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Knowledge center

Application notes, case studies, frequently asked questions and a glossary.

Glossary

Glossary

ARC® – Accelerating Rate Calorimeter

Accelerating Rate Calorimeter: battery safety and thermal runaway studies.

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Glossary

Ceramics Genome® – Ceramic modeling and data management

Ceramic modeling and data management: formulation, traceability, data.

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Glossary

DEA – Dielectric Analysis

Dielectric Analysis: curing and dielectric behavior.

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Glossary

DIL – Dilatometer

Dilatometer: thermal expansion, sintering.

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Glossary

DMA – Dynamic Mechanical Analysis

Dynamic Mechanical Analysis: viscoelastic behavior.

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Glossary

DSC/DTA – Differential Scanning Calorimetry

Differential Scanning Calorimetry: thermal transitions, melting, crystallization, curing.

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Glossary

ELS-MDF® – Modular optical thermal analysis

Modular optical thermal analysis: ceramics, glass, metals, refractories.

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Glossary

FT-IR / MS / GC-MS – Evolved Gas Analysis

Evolved Gas Analysis: identification of gaseous products.

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Glossary

HFM/GHFM – Heat Flow Meter

Heat Flow Meter: thermal conductivity.

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Glossary

Heating Microscope

Heating microscope: fusion / softening / melting.

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Glossary

Capillary Rheometer – Melt flow behavior

Melt flow behavior: polymer processing.

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Glossary

LFA – Light/Laser Flash

Light/Laser Flash: thermal diffusivity.

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Glossary

Optical Dilatometer

Optical dilatometer: CTE, sintering, firing cycle.

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Glossary

Optical Fleximeter

Optical fleximeter: pyroplasticity, deformation.

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Glossary

Rotational Rheometer – Flow and viscoelastic properties

Flow and viscoelastic properties: polymers, paints, adhesives, etc.

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Glossary

STA/TGA-DSC – Simultaneous Thermal Analysis

Simultaneous Thermal Analysis: mass change + thermal effects.

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Glossary

TDTR – Time Domain Thermoreflectance

Time Domain Thermoreflectance: thin films / fast thermal characterization.

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Glossary

TGA – Thermogravimetric Analysis

Thermogravimetric Analysis: decomposition, stability, composition.

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Glossary

TMA – Thermomechanical Analysis

Thermomechanical Analysis: dimensional change and thermal expansion.

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